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"Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor ..."

Pan Xiao et al. (2023)

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DOI: 10.1109/TIM.2023.3235435

access: closed

type: Journal Article

metadata version: 2024-02-13

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Pan Xiao, Meng Xiao, Nian Cai, Baojun Qiu, Shuai Zhou, Han Wang:
Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints. IEEE Trans. Instrum. Meas. 72: 1-12 (2023)

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