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"The study of buffer structure of on-board test's circuit module in high shock."

Peng Xu, Jing Zu, Zu-Seng Lin (2004)

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DOI: 10.1109/TIM.2004.830566

access: closed

type: Journal Article

metadata version: 2020-06-08

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  - journals/tim/XuZL04
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Peng Xu, Jing Zu, Zu-Seng Lin:
The study of buffer structure of on-board test's circuit module in high shock. IEEE Trans. Instrum. Meas. 53(4): 1224-1226 (2004)

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