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"Power-safe application of tdf patterns to flip-chip designs during wafer test."

Wei Zhao et al. (2013)

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DOI: 10.1145/2491477.2491487

access: closed

type: Journal Article

metadata version: 2018-11-06

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  - https://dblp.org/rec/journals/todaes/ZhaoMTC13
Wei Zhao, Junxia Ma, Mohammad Tehranipoor, Sreejit Chakravarty:
Power-safe application of tdf patterns to flip-chip designs during wafer test. ACM Trans. Design Autom. Electr. Syst. 18(3): 43:1-43:20 (2013)

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