"TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement ..."

Donghyun Han et al. (2025)

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DOI: 10.1109/TR.2024.3434631

access: closed

type: Journal Article

metadata version: 2025-09-21

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Donghyun Han, Duyeon Won, Sunghoon Kim, Sungho Kang:
TSV Built-In Self-Repair Architecture for Lifespan Reliability Enhancement of HBM. IEEE Trans. Reliab. 74(3): 4143-4157 (2025)

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