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"Inter-Tier Process-Variation-Aware Monolithic 3-D NoC Design Space ..."

Shouvik Musavvir et al. (2020)

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DOI: 10.1109/TVLSI.2019.2954770

access: closed

type: Journal Article

metadata version: 2022-04-15

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  - https://dblp.org/rec/journals/tvlsi/MusavvirCKKP20
Shouvik Musavvir, Anwesha Chatterjee, Ryan Gary Kim, Dae Hyun Kim, Partha Pratim Pande:
Inter-Tier Process-Variation-Aware Monolithic 3-D NoC Design Space Exploration. IEEE Trans. Very Large Scale Integr. Syst. 28(3): 686-699 (2020)

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