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"Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture ..."

Hiroyuki Ochi et al. (2018)

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DOI: 10.1109/TVLSI.2018.2812914

access: open

type: Journal Article

metadata version: 2020-03-11

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  - https://dblp.org/rec/journals/tvlsi/OchiYFHKHIDTSTW18
Hiroyuki Ochi, Kosei Yamaguchi, Tetsuaki Fujimoto, Junshi Hotate, Takashi Kishimoto, Toshiki Higashi, Takashi Imagawa, Ryutaro Doi, Munehiro Tada, Tadahiko Sugibayashi, Wataru Takahashi, Kazutoshi Wakabayashi, Hidetoshi Onodera, Yukio Mitsuyama, Jaehoon Yu, Masanori Hashimoto:
Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture With Overlay Via-Switch Crossbars. IEEE Trans. Very Large Scale Integr. Syst. 26(12): 2723-2736 (2018)

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