"Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF ..."

Chenbing Qu et al. (2021)

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DOI: 10.1109/TVLSI.2020.3036385

access: closed

type: Journal Article

metadata version: 2021-02-11

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Chenbing Qu, Zhangming Zhu, Yunfei En, Liwei Wang, Xiaoxian Liu:
Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications. IEEE Trans. Very Large Scale Integr. Syst. 29(2): 287-296 (2021)

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