Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Recovery-Aware Proactive TSV Repair for Electromigration Lifetime ..."

Shengcheng Wang et al. (2018)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2017.2775586

access: closed

type: Journal Article

metadata version: 2021-02-19

- view
  authority control:
- export record
  dblp key:
  - journals/tvlsi/WangKSTT18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/WangKSTT18
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26(3): 531-543 (2018)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.