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@article{DBLP:journals/mr/AgboTKHWCCD18,
author = {Innocent Agbo and
Mottaqiallah Taouil and
Daniel Kraak and
Said Hamdioui and
Pieter Weckx and
Stefan Cosemans and
Francky Catthoor and
Wim Dehaene},
title = {Impact and mitigation of {SRAM} read path aging},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {158--167},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.011},
doi = {10.1016/J.MICROREL.2018.05.011},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/AgboTKHWCCD18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/AlexeevMO18,
author = {Anton Alexeev and
Genevieve Martin and
Grigory Onushkin},
title = {Multiple heat path dynamic thermal compact modeling for silicone encapsulated
LEDs},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {89--96},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.014},
doi = {10.1016/J.MICROREL.2018.05.014},
timestamp = {Thu, 16 Jul 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/AlexeevMO18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/AuerspergACDVWR18,
author = {J{\"{u}}rgen Auersperg and
Ellen Auerswald and
Christian Collet and
Thierry Dean and
Dietmar Vogel and
Thomas Winkler and
Sven Rzepka},
title = {Investigations of the impact of initial stresses on fracture and delamination
risks of an avionics {MEMS} pressure sensor},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {238--244},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.019},
doi = {10.1016/J.MICROREL.2018.06.019},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/AuerspergACDVWR18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/BojitaBPFSP18,
author = {Adrian Bojita and
Cristian Boianceanu and
Marius Purcar and
Ciprian Florea and
Dan Simon and
Cosmin{-}Sorin Plesa},
title = {A simple metal-semiconductor substructure for the advanced thermo-mechanical
numerical modeling of the power integrated circuits},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {142--150},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.013},
doi = {10.1016/J.MICROREL.2018.06.013},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/BojitaBPFSP18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/CodecasaBDdMR18,
author = {Lorenzo Codecasa and
Robin Bornoff and
James Dyson and
Vincenzo d'Alessandro and
Alessandro Magnani and
Niccol{\`{o}} Rinaldi},
title = {Versatile MOR-based boundary condition independent compact thermal
models with multiple heat sources},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {194--205},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.03.030},
doi = {10.1016/J.MICROREL.2018.03.030},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/CodecasaBDdMR18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/DeckerRRB18,
author = {Karsten M. Decker and
Ren{\'{e}} M. Rehmann and
Mike Roellig and
Karlheinz Bock},
title = {Fatigue measurement setup under combined thermal and vibration loading
on electronic {SMT} assembly},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {125--132},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.003},
doi = {10.1016/J.MICROREL.2018.06.003},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/DeckerRRB18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/DuongPR18,
author = {Pham Luu Trung Duong and
Hyunseok Park and
Nagarajan Raghavan},
title = {Application of expectation maximization and Kalman smoothing for prognosis
of lumen maintenance life for light emitting diodes},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {206--212},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.011},
doi = {10.1016/J.MICROREL.2018.06.011},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/DuongPR18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/FanHWLL18,
author = {Peng Fan and
Shoudao Huang and
Huai Wang and
Huimin Li and
Derong Luo},
title = {From chip to inverter: Electro-thermal modeling and design for paralleled
power devices in high power application},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {271--277},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.03.040},
doi = {10.1016/J.MICROREL.2018.03.040},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/FanHWLL18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GainZ18a,
author = {Asit Kumar Gain and
Liangchi Zhang},
title = {Growth nature of in-situ Cu\({}_{\mbox{6}}\)Sn\({}_{\mbox{5}}\)-phase
and their influence on creep and damping characteristics of Sn-Cu
material under high-temperature and humidity},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {278--285},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.07.053},
doi = {10.1016/J.MICROREL.2018.07.053},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/GainZ18a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GosWERJSG18,
author = {Wolfgang Goes and
Yannick Wimmer and
Al{-}Moatasem El{-}Sayed and
Gerhard Rzepa and
Markus Jech and
Alexander L. Shluger and
Tibor Grasser},
title = {Identification of oxide defects in semiconductor devices: {A} systematic
approach linking {DFT} to rate equations and experimental evidence},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {286--320},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2017.12.021},
doi = {10.1016/J.MICROREL.2017.12.021},
timestamp = {Thu, 13 Jul 2023 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/GosWERJSG18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GranigFZ18,
author = {Wolfgang Granig and
Lisa{-}Marie Faller and
Hubert Zangl},
title = {Sensor system optimization to meet reliability targets},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {113--124},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.005},
doi = {10.1016/J.MICROREL.2018.06.005},
timestamp = {Sat, 05 Sep 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/GranigFZ18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/Hammad18,
author = {A. E. Hammad},
title = {Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu
lead-free solder by adding trace amount of elements Ni and Sb},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {133--141},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.015},
doi = {10.1016/J.MICROREL.2018.06.015},
timestamp = {Mon, 26 Oct 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/Hammad18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/HeHZQHQWS18,
author = {Wei He and
Guan{-}Yu Hu and
Zhi{-}Jie Zhou and
Peili Qiao and
Xiaoxia Han and
Yuan{-}Yuan Qu and
Hang Wei and
Chun Shi},
title = {A new hierarchical belief-rule-based method for reliability evaluation
of wireless sensor network},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {33--51},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.019},
doi = {10.1016/J.MICROREL.2018.05.019},
timestamp = {Mon, 03 Jan 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/HeHZQHQWS18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LeeKHKLK18,
author = {Hyunju Lee and
Cheolmin Kim and
Cheolho Heo and
Chiho Kim and
Jae{-}Ho Lee and
Yangdo Kim},
title = {Effect of solder resist dissolution on the joint reliability of {ENIG}
surface and Sn-Ag-Cu solder},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {75--80},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.017},
doi = {10.1016/J.MICROREL.2018.05.017},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/LeeKHKLK18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LiCLD18,
author = {Hao Li and
Mifang Cong and
Ke Li and
Huan Du},
title = {Source engineering on ruggedness and {RF} performance of n-channel
{RFLDMOS}},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {57--63},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.001},
doi = {10.1016/J.MICROREL.2018.06.001},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/LiCLD18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LiCNCWLCKSGBWW18,
author = {Yuanqing Li and
Li Chen and
Issam Nofal and
Mo Chen and
Haibin Wang and
Rui Liu and
Qingyu Chen and
Milos Krstic and
Shuting Shi and
Gang Guo and
Sang H. Baeg and
Shi{-}Jie Wen and
Richard Wong},
title = {Modeling and analysis of single-event transient sensitivity of a 65{\unicode{8239}}nm
clock tree},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {24--32},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.016},
doi = {10.1016/J.MICROREL.2018.05.016},
timestamp = {Mon, 05 Feb 2024 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/LiCNCWLCKSGBWW18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LiuFCLL18,
author = {Weichao Liu and
Xiang Fang and
Qianqian Chen and
Yingxin Li and
Ting Li},
title = {Reliability analysis of an integrated device of ECG, {PPG} and pressure
pulse wave for cardiovascular disease},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {183--187},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.008},
doi = {10.1016/J.MICROREL.2018.06.008},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/LiuFCLL18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LofranoCGB18,
author = {Melina Lofrano and
Vladimir Cherman and
Mario Gonzalez and
Eric Beyne},
title = {Enhanced Cu pillar design to reduce thermomechanical stress induced
during flip chip assembly},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {97--105},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.004},
doi = {10.1016/J.MICROREL.2018.06.004},
timestamp = {Thu, 14 Oct 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/LofranoCGB18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/NishimotoMONM18,
author = {Shuji Nishimoto and
Seyed Ali Moeini and
Toyo Ohashi and
Yoshiyuki Nagatomo and
F. Patrick McCluskey},
title = {Novel silver die-attach technology on silver pre-sintered {DBA} substrates
for high temperature applications},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {232--237},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.010},
doi = {10.1016/J.MICROREL.2018.06.010},
timestamp = {Tue, 01 Jun 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/NishimotoMONM18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/NiuWSWLP18,
author = {Yuling Niu and
Jing Wang and
Shuai Shao and
Huayan Wang and
Hohyung Lee and
Seungbae Park},
title = {A comprehensive solution for electronic packages' reliability assessment
with digital image correlation {(DIC)} method},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {81--88},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.006},
doi = {10.1016/J.MICROREL.2018.06.006},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/NiuWSWLP18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/NouguierFGRR18,
author = {D. Nouguier and
X. Federspiel and
G{\'{e}}rard Ghibaudo and
M. Rafik and
David Roy},
title = {New {NBTI} models for degradation and relaxation kinetics valid over
extended temperature and stress/recovery ranges},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {106--112},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.04.009},
doi = {10.1016/J.MICROREL.2018.04.009},
timestamp = {Mon, 03 Jan 2022 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/NouguierFGRR18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/NwanoroLYB18,
author = {Kenneth Chimezie Nwanoro and
Hua Lu and
Chunyan Yin and
Chris Bailey},
title = {An analysis of the reliability and design optimization of aluminium
ribbon bonds in power electronics modules using computer simulation
method},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {1--14},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.013},
doi = {10.1016/J.MICROREL.2018.05.013},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/NwanoroLYB18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/QinZCHL18,
author = {Qi Qin and
Shuai Zhao and
Shaowei Chen and
Dengshan Huang and
Jian Liang},
title = {Adaptive and robust prediction for the remaining useful life of electrolytic
capacitors},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {64--74},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.020},
doi = {10.1016/J.MICROREL.2018.05.020},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/QinZCHL18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/RajaM18,
author = {P. Vigneshwara Raja and
Neti V. L. Narasimha Murty},
title = {Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes
over wide temperature range},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {213--221},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.021},
doi = {10.1016/J.MICROREL.2018.06.021},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/RajaM18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/RogieCMBLDDMdR18,
author = {Brice Rogi{\'{e}} and
Lorenzo Codecasa and
Eric Monier{-}Vinard and
Valentin Bissuel and
Najib Laraqi and
Olivier Daniel and
Dario D'Amore and
Alessandro Magnani and
Vincenzo d'Alessandro and
Niccol{\`{o}} Rinaldi},
title = {Multi-port dynamic compact thermal models of dual-chip package using
model order reduction and metaheuristic optimization},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {222--231},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.009},
doi = {10.1016/J.MICROREL.2018.06.009},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/RogieCMBLDDMdR18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ShahYBV18,
author = {Ambika Prasad Shah and
Nandakishor Yadav and
Ankur Beohar and
Santosh Kumar Vishvakarma},
title = {An efficient {NBTI} sensor and compensation circuit for stable and
reliable {SRAM} cells},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {15--23},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.015},
doi = {10.1016/J.MICROREL.2018.05.015},
timestamp = {Fri, 27 Mar 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ShahYBV18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/SootkaneungHC18,
author = {Warin Sootkaneung and
Suppachai Howimanporn and
Sasithorn Chookaew},
title = {Temperature effects on {BTI} and soft errors in modern logic circuits},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {259--270},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.07.032},
doi = {10.1016/J.MICROREL.2018.07.032},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/SootkaneungHC18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ZajacN18,
author = {Piotr Zajac and
Andrzej Napieralski},
title = {Novel thermal model of microchannel cooling system designed for fast
simulation of liquid-cooled ICs},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {245--258},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.020},
doi = {10.1016/J.MICROREL.2018.06.020},
timestamp = {Fri, 09 Apr 2021 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/ZajacN18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ZhangLZJRHZWGW18,
author = {D. Zhang and
T. R. Li and
J. W. Zhou and
Y. C. Jiang and
B. Ren and
J. Huang and
J. M. Zhang and
Lin Wang and
Ju Gao and
L. J. Wang},
title = {Asymmetric resistive switching behaviour in a Au/a-C: Co/Au planar
structure},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {52--56},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.05.021},
doi = {10.1016/J.MICROREL.2018.05.021},
timestamp = {Fri, 07 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/ZhangLZJRHZWGW18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ZhaoHCCCZWSZGD18,
author = {Wen Zhao and
Chaohui He and
Wei Chen and
Rongmei Chen and
Peitian Cong and
Fengqi Zhang and
Zujun Wang and
Chen Shen and
Lisang Zheng and
Xiaoqiang Guo and
Lili Ding},
title = {Single-event multiple transients in guard-ring hardened inverter chains
of different layout designs},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {151--157},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.014},
doi = {10.1016/J.MICROREL.2018.06.014},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ZhaoHCCCZWSZGD18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ZhaoLPL18,
author = {Ke Zhao and
Nanxi Li and
Boan Pan and
Ting Li},
title = {Performance assessment of the NIRS-based medical system of evaluating
therapeutic effect},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {188--193},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.017},
doi = {10.1016/J.MICROREL.2018.06.017},
timestamp = {Thu, 22 Oct 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/ZhaoLPL18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ZhihongXY18,
author = {Zhihong Wu and
Su Xiezu and
Zhu Yuan},
title = {{IGBT} junction and coolant temperature estimation by thermal model},
journal = {Microelectron. Reliab.},
volume = {87},
pages = {168--182},
year = {2018},
url = {https://doi.org/10.1016/j.microrel.2018.06.018},
doi = {10.1016/J.MICROREL.2018.06.018},
timestamp = {Sun, 11 Sep 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/ZhihongXY18.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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