• case-insensitive prefix search: default
  e.g., sig matches "SIGIR" as well as "signal"
• exact word search: append dollar sign ($) to word
  e.g., graph$ matches "graph", but not "graphics"
• boolean and: separate words by space
  e.g., codd model
• boolean or: connect words by pipe symbol (|)
  e.g., graph|network

Update May 7, 2017: Please note that we had to disable the phrase search operator (.) and the boolean not operator (-) due to technical problems. For the time being, phrase search queries will yield regular prefix search result, and search terms preceded by a minus will be interpreted as regular (positive) search terms.

found 19 matches

• 2017
• 
  Furat Al-Obaidy, Farhang Yazdani, Farah A. Mohammadi:
  Fault detection using thermal image based on soft computing methods: Comparative study. Microelectron. Reliab. 71: 56-64 (2017)
• 
  Rongmei Chen, Wei Chen, Xiaoqiang Guo, Chen Shen, Fengqi Zhang, Lisang Zheng, Wen Zhao, Lili Ding, Yinhong Luo, Hongxia Guo, Yuanming Wang, Yinong Liu:
  Improved on-chip self-triggered single-event transient measurement circuit design and applications. Microelectron. Reliab. 71: 99-105 (2017)
• 
  Qi Chen, Run Hu, Xiaobing Luo:
  A statistical study to identify the effects of packaging structures on lumen reliability of LEDs. Microelectron. Reliab. 71: 51-55 (2017)
• 
  Yilong Chen, Jianyuan Jia, Hongzhi Fu, Zhaofei Zhu:
  Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing. Microelectron. Reliab. 71: 134-142 (2017)
• 
  Xuecheng Du, Shuhuan Liu, Dongyang Luo, Yao Zhang, Xiaozhi Du, Chaohui He, Xiaotang Ren, Weitao Yang, Yuan Yuan:
  Single event effects sensitivity of low energy proton in Xilinx Zynq-7010 system-on chip. Microelectron. Reliab. 71: 65-70 (2017)
• 
  Claudiu Ionita, Muhammad Nawaz, Kalle Ilves:
  On the short-circuit and avalanche ruggedness reliability assessment of SiC MOSFET modules. Microelectron. Reliab. 71: 6-16 (2017)
• 
  Alice Lassnig, Martin Lederer, Golta Khatibi, Rainer Pelzer, W. Robl, Michael Nelhiebel:
  High cycle fatigue testing of thermosonic ball bonds. Microelectron. Reliab. 71: 91-98 (2017)
• 
  Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon:
  Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. Microelectron. Reliab. 71: 119-125 (2017)
• 
  Shuibao Liang, Changbo Ke, Wenjing Ma, Minbo Zhou, Xinping Zhang:
  Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects. Microelectron. Reliab. 71: 71-81 (2017)
• 
  Jizhi Liu, Qian Lingli, Tian Rui, Zhiwei Liu, Zhao Liu, Cheng Hui:
  Self-triggered stacked silicon-controlled rectifier structure (STSSCR) for on-chip electrostatic discharge (ESD) protection. Microelectron. Reliab. 71: 1-5 (2017)
• 
  L. Liu, S. Li, Y. M. Zhou, L. Y. Liu, Xian An Cao:
  High-current stressing of organic light-emitting diodes with different electron-transport materials. Microelectron. Reliab. 71: 106-110 (2017)
• 
  Junji Sakamoto, Hisakazu Ohara, Tadahiro Shibutani:
  Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn. Microelectron. Reliab. 71: 29-34 (2017)
• 
  M. Shokravi:
  Dynamic pull-in and pull-out analysis of viscoelastic nanoplates under electrostatic and Casimir forces via sinusoidal shear deformation theory. Microelectron. Reliab. 71: 17-28 (2017)
• 
  Shihai Tan, Jing Han, Fu Guo:
  Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock. Microelectron. Reliab. 71: 126-133 (2017)
• 
  Hiep Tran, Masturina Kracica, Dougal McCulloch, Edwin Mayes, Anthony Holland, James Partridge:
  Energetic deposition, measurement and simulation of graphitic contacts to 6H-SiC. Microelectron. Reliab. 71: 82-85 (2017)
• 
  Brendan Ubochi, Soroush Faramehr, Khaled Ahmeda, Petar Igic, Karol Kalna:
  Operational frequency degradation induced trapping in scaled GaN HEMTs. Microelectron. Reliab. 71: 35-40 (2017)
• 
  Jiang Xia, Guoyuan Li, Bin Li, LanXian Cheng, Bin Zhou:
  Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading. Microelectron. Reliab. 71: 111-118 (2017)
• 
  Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon:
  Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. Microelectron. Reliab. 71: 41-50 (2017)
• 
  Peijian Zhang, Xue Wu, Qianning Yi, Wensuo Chen, Yonghui Yang, Kunfeng Zhu, Kaizhou Tan, Yi Zhong:
  A comparison of the effects of cobalt-60 γ ray irradiation on DPSA bipolar transistors at high and low injection levels. Microelectron. Reliab. 71: 86-90 (2017)