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BibTeX record journals/cacm/JungMPL14
@article{DBLP:journals/cacm/JungMPL14, author = {Moongon Jung and Joydeep Mitra and David Z. Pan and Sung Kyu Lim}, title = {{TSV} stress-aware full-chip mechanical reliability analysis and optimization for 3D {IC}}, journal = {Commun. {ACM}}, volume = {57}, number = {1}, pages = {107--115}, year = {2014}, url = {https://doi.org/10.1145/2494536}, doi = {10.1145/2494536}, timestamp = {Sun, 02 Oct 2022 15:29:10 +0200}, biburl = {https://dblp.org/rec/journals/cacm/JungMPL14.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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