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"TSV stress-aware full-chip mechanical reliability analysis and ..."

Moongon Jung et al. (2014)

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DOI: 10.1145/2494536

access: closed

type: Journal Article

metadata version: 2022-10-02

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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Commun. ACM 57(1): 107-115 (2014)

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