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ORCID3DIC 2023: Cork, Ireland
- IEEE International 3D Systems Integration Conference, 3DIC 2023, Cork, Ireland, May 10-12, 2023. IEEE 2023, ISBN 979-8-3503-1137-2
- Po-Yao Chuang
, Francesco Lorenzelli, Sreejit Chakravarty, Slimane Boutobza, Cheng-Wen Wu, Georges G. E. Gielen, Erik Jan Marinissen:
Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages. 1-6 - Pouria Zaghari, Sourish S. Sinha, Jong Eun Ryu, Paul D. Franzon, Douglas C. Hopkins:
Thermal Cycling and Fatigue Life Analysis of a Laterally Conducting GaN-based Power Package. 1-5 - Erik W. Masselink, Andrew Stark, Benjamin B. Yang, T. Robert Harris:
Review of Hybrid Integration Techniques for Integrating III-V Onta Silicon. 1-7 - Mariappan Murugesan, Masahiro Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima:
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 1-4 - Koutaro Hachiya:
Measurement Point Selection Algorithms for Testing Power TSVs. 1-4 - Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima:
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 1-4 - Joshua A. Stevens, Tse-Han Pan, Prasanth Prabu Ravichandiran, Paul D. Franzon:
Chiplet Set For Artificial Intelligence. 1-5 - Priyank Kashyap, Prasanth Prabu Ravichandiran, Lee Wang, Dror Baron, Chau-Wai Wong, Tianfu Wu, Paul D. Franzon:
Thermal Estimation for 3D-ICs Through Generative Networks. 1-4 - Nermeen Hossam, John Ferguson:
Fast, Accurate Assembly-Level Physical Verification of 3DIC Packages. 1-4 - Somnath Pal, Liang Ye, James O'Callaghan, Fatih Bilge Atar, Cian O'Mathuna, Brian Corbett, Ranajit Sai, Sambuddha Khan:
A Study on a Tether-Less Approach Towards Micro-Transfer-Printing of Large-Footprint Power Micro-Inductor Chiplets. 1-4 - Emre Can Durmaz, Carl Heine, Zhibo Cao, Jens Lehmann, Dietmar Kissinger, Matthias Wietstruck:
SiGe BiCMOS Technology with Embedded Microchannels based on Cu Pillar PCB Integration Enabling sub-THz Microfluidic Sensor Applications. 1-4 - Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic:
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 1-4
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