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ORCIDVLSI-SoC 2023: Dubai, UAE - Selected Papers
- Ibrahim Abe M. Elfadel, Lutfi Albasha
:
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence - 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16-18, 2023, Revised Extended Selected Papers. IFIP Advances in Information and Communication Technology 680, Springer 2024, ISBN 978-3-031-70946-3
Architectures
- Rassul Bairamkulov, Alessandro Tempia Calvino, Giovanni De Micheli:
Synthesis of SFQ Circuits with Compound Gates. 3-19 - Rebecca Pelke, Nils Bosbach, Niklas Degener, José Cubero-Cascante, Felix Staudigl, Rainer Leupers, Jan Moritz Joseph:
Architecture-Compiler Co-design for ReRAM-Based Multi-core CIM Architectures. 21-44 - N. S. Aswathy, Aishwarya Gupta, Hemangee K. Kapoor:
A Leap of Confidence: A Write-Intensity Aware Prudent Page Migration for Hybrid Memories. 45-71 - Siyi Wang, Anupam Chattopadhyay:
Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure. 73-89
Accelerators
- Mohammed Thari Nabeel, Deepraj Soni, Ramesh Karri, Michail Maniatakos:
Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility. 93-108 - Jingbo Jiang, Xizi Chen, Chi-Ying Tsui:
Accelerating Large Kernel Convolutions with Nested Winograd Transformation. 109-125 - Yi Chen, Jie Lou, Christian Lanius, Florian Freye, Johnson Loh, Tobias Gemmeke:
A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator. 127-146
Resiliency and Robustness
- Robert Limas Sierra, Juan-David Guerrero-Balaguera, Josie E. Rodriguez Condia, Matteo Sonza Reorda:
Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats. 149-176 - Anton Datsuk, Philip Ostrovskyy, Frank Vater, Christian Wieden:
Advanced Quality Assurance Platform for Robust Process Design Kits. 177-195 - Gabriel Rutsch, Konrad Maier, Wolfgang Ecker:
FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products. 197-216 - Sagheer Ahmed, Jayesh Ambulkar, Debabrata Mondal, Ambika Prasad Shah:
Radiation Tolerant 14T SRAM Cell for Avionics Applications. 217-236 - Solomon Michael Serunjogi, Mihai Sanduleanu:
3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect. 237-248
Security and Privacy
- Lennart M. Reimann, Jonathan Wiesner, Karol Jaszczyk, Chiara Ghinami, Dominik Germek, Farhad Merchant, Rainer Leupers:
Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature. 251-272 - Rupesh Raj Karn, Mizan Abraha Gebremichael, Kashif Nawaz, Ibrahim M. Elfadel:
Confidential Inference in Decision Trees. 273-297 - Anjum Riaz, Gaurav Kumar, Pardeep Kumar, Yamuna Prasad, Satyadev Ahlawat:
Enhancing the Security of IJTAG Network Using Inherently Secure SIB. 299-318
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