Daeyeon Kim

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Ronald G. Dreslinski

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Publications

2013
[j10]
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Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory K. Chen, Dennis Sylvester, David T. Blaauw, Trevor N. Mudge:
Centip3De: a many-core prototype exploring 3D integration and near-threshold computing. Commun. ACM 56(11): 97-104 (2013)
[j8]
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David Fick, Ronald G. Dreslinski, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory K. Chen, Trevor N. Mudge, David T. Blaauw, Dennis Sylvester:
Centip3De: A Cluster-Based NTC Architecture With 64 ARM Cortex-M3 Cores in 3D Stacked 130 nm CMOS. IEEE J. Solid State Circuits 48(1): 104-117 (2013)
[j6]
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Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory K. Chen, Dennis Sylvester, David T. Blaauw, Trevor N. Mudge:
Centip3De: A 64-Core, 3D Stacked Near-Threshold System. IEEE Micro 33(2): 8-16 (2013)
2012
[c14]
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  - conf/hotchips/DreslinskiFGKSF12
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Ronald G. Dreslinski, David Fick, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory K. Chen, Trevor N. Mudge, Dennis Sylvester, David T. Blaauw:
Centip3De: A 64-core, 3D stacked, near-threshold system. Hot Chips Symposium 2012: 1-30
[c11]
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David Fick, Ronald G. Dreslinski, Bharan Giridhar, Gyouho Kim, Sangwon Seo, Matthew Fojtik, Sudhir Satpathy, Yoonmyung Lee, Daeyeon Kim, Nurrachman Liu, Michael Wieckowski, Gregory K. Chen, Trevor N. Mudge, Dennis Sylvester, David T. Blaauw:
Centip3De: A 3930DMIPS/W configurable near-threshold 3D stacked system with 64 ARM Cortex-M3 cores. ISSCC 2012: 190-192

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