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Brian Zimmer
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Publications
- 2024
- [j13]Yoshinori Nishi, John W. Poulton, Walker J. Turner, Xi Chen, Sanquan Song, Brian Zimmer, Stephen G. Tell, Nikola Nedovic, John M. Wilson, William J. Dally, C. Thomas Gray:
A 0.190-pJ/bit 25.2-Gb/s/wire Inverter-Based AC-Coupled Transceiver for Short-Reach Die-to-Die Interfaces in 5-nm CMOS. IEEE J. Solid State Circuits 59(4): 1146-1157 (2024) - [c29]Sudhir S. Kudva, Mahmut Ersin Sinangil, Stephen G. Tell, Nikola Nedovic, Sanquan Song, Brian Zimmer, C. Thomas Gray:
16.4 High-Density and Low-Power PUF Designs in 5nm Achieving 23× and 39× BER Reduction After Unstable Bit Detection and Masking. ISSCC 2024: 302-304 - 2023
- [j12]Yoshinori Nishi, John W. Poulton, Walker J. Turner, Xi Chen, Sanquan Song, Brian Zimmer, Stephen G. Tell, Nikola Nedovic, John M. Wilson, William J. Dally, C. Thomas Gray:
A 0.297-pJ/Bit 50.4-Gb/s/Wire Inverter-Based Short-Reach Simultaneous Bi-Directional Transceiver for Die-to-Die Interface in 5-nm CMOS. IEEE J. Solid State Circuits 58(4): 1062-1073 (2023) - [c28]Yoshinori Nishi, John W. Poulton, Xi Chen, Sanquan Song, Brian Zimmer, Walker J. Turner, Stephen G. Tell, Nikola Nedovic, John M. Wilson, William J. Dally, C. Thomas Gray:
A 0.190-pJ/bit 25.2-Gb/s/wire Inverter-Based AC-Coupled Transceiver for Short-Reach Die-to-Die Interfaces in 5-nm CMOS. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c24]Sanquan Song, Stephen G. Tell, Brian Zimmer, Sudhir S. Kudva, Nikola Nedovic, C. Thomas Gray:
An FLL-Based Clock Glitch Detector for Security Circuits in a 5nm FINFET Process. VLSI Technology and Circuits 2022: 146-147 - [c23]Yoshinori Nishi, John W. Poulton, Xi Chen, Sanquan Song, Brian Zimmer, Walker J. Turner, Stephen G. Tell, Nikola Nedovic, John M. Wilson, William J. Dally, C. Thomas Gray:
A 0.297-pJ/bit 50.4-Gb/s/wire Inverter-Based Short-Reach Simultaneous Bidirectional Transceiver for Die-to-Die Interface in 5nm CMOS. VLSI Technology and Circuits 2022: 154-155 - 2020
- [c21]Xi Chen, Nikola Nedovic, Stephen G. Tell, Sudhir S. Kudva, Brian Zimmer, Thomas H. Greer, John W. Poulton, Sanquan Song, Walker J. Turner, John M. Wilson, C. Thomas Gray:
6.6 Reference-Noise Compensation Scheme for Single-Ended Package-to-Package Links. ISSCC 2020: 126-128 - 2019
- [j7]John W. Poulton, John M. Wilson, Walker J. Turner, Brian Zimmer, Xi Chen, Sudhir S. Kudva, Sanquan Song, Stephen G. Tell, Nikola Nedovic, Wenxu Zhao, Sunil R. Sudhakaran, C. Thomas Gray, William J. Dally:
A 1.17-pJ/b, 25-Gb/s/pin Ground-Referenced Single-Ended Serial Link for Off- and On-Package Communication Using a Process- and Temperature-Adaptive Voltage Regulator. IEEE J. Solid State Circuits 54(1): 43-54 (2019) - [c19]Xi Chen, Sanquan Song, John Poulton, Nikola Nedovic, Brian Zimmer, Stephen G. Tell, C. Thomas Gray:
Voltage-Follower Coupling Quadrature Oscillator with Embedded Phase-Interpolator in 16nm FinFET. CICC 2019: 1-4 - [c18]Sanquan Song, John Poulton, Xi Chen, Brian Zimmer, Stephen G. Tell, Walker J. Turner, Sudhir S. Kudva, Nikola Nedovic, John M. Wilson, C. Thomas Gray, William J. Dally:
A 2-to-20 GHz Multi-Phase Clock Generator with Phase Interpolators Using Injection-Locked Oscillation Buffers for High-Speed IOs in 16nm FinFET. CICC 2019: 1-4 - [c17]Angad S. Rekhi, Brian Zimmer, Nikola Nedovic, Ningxi Liu, Rangharajan Venkatesan, Miaorong Wang, Brucek Khailany, William J. Dally, C. Thomas Gray:
Analog/Mixed-Signal Hardware Error Modeling for Deep Learning Inference. DAC 2019: 81 - 2018
- [c12]Walker J. Turner, John W. Poulton, John M. Wilson, Xi Chen, Stephen G. Tell, Matthew Fojtik, Thomas H. Greer, Brian Zimmer, Sanquan Song, Nikola Nedovic, Sudhir S. Kudva, Sunil R. Sudhakaran, Rizwan Bashirullah, Wenxu Zhao, William J. Dally, C. Thomas Gray:
Ground-referenced signaling for intra-chip and short-reach chip-to-chip interconnects. CICC 2018: 1-8 - [c10]John M. Wilson, Walker J. Turner, John W. Poulton, Brian Zimmer, Xi Chen, Sudhir S. Kudva, Sanquan Song, Stephen G. Tell, Nikola Nedovic, Wenxu Zhao, Sunil R. Sudhakaran, C. Thomas Gray, William J. Dally:
A 1.17pJ/b 25Gb/s/pin ground-referenced single-ended serial link for off- and on-package communication in 16nm CMOS using a process- and temperature-adaptive voltage regulator. ISSCC 2018: 276-278
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last updated on 2024-08-05 20:22 CEST by the dblp team
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