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Tsair-Wang Chung

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2012
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Yung-Sen Lin, Jian-Zhi Xu, Shih-Wei Tien, Shih-Chan Hung, Wei-Li Yuan, Tsair-Wang Chung, Char-Ming Huang:
Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas. Microelectron. Reliab. 52(11): 2756-2762 (2012)

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