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ORCIDThorben Casper
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2020 – today
- 2020
[j1]Thorben Casper
, Ulrich Römer, Herbert De Gersem, Sebastian Schöps:
Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging. Comput. Math. Appl. 79(6): 1781-1801 (2020)
2010 – 2019
- 2019
- [i8]Katrin Hirmer, Thorben Casper, Sebastian Schöps, Klaus Hofmann:
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements. CoRR abs/1910.06831 (2019) - 2018
- [c2]Steve Bigalke, Jens Lienig, Thorben Casper, Sebastian Schöps:
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization. PRIME 2018: 89-92 - [i7]Thorben Casper, David Duque, Sebastian Schöps, Herbert De Gersem:
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems. CoRR abs/1809.08588 (2018) - [i6]Thorben Casper, Ulrich Römer, Sebastian Schöps, Herbert De Gersem:
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging. CoRR abs/1809.09034 (2018) - [i5]Alexander Krimm, Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ludovic Chamoin:
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique. CoRR abs/1812.06867 (2018) - 2016
- [c1]Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps:
Electrothermal simulation of bonding wire degradation under uncertain geometries. DATE 2016: 1297-1302 - [i4]Thorben Casper, Ulrich Römer, Sebastian Schöps:
Determination of Bond Wire Failure Probabilities in Microelectronic Packages. CoRR abs/1609.06187 (2016) - [i3]Dimitrios Loukrezis, Ulrich Römer, Thorben Casper, Sebastian Schöps, Herbert De Gersem:
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition. CoRR abs/1610.03863 (2016) - [i2]Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps:
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries. CoRR abs/1610.04303 (2016) - [i1]Thorben Casper, Herbert De Gersem, Sebastian Schöps:
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models. CoRR abs/1610.04304 (2016)
Coauthor Index
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