"Coupled simulation of transient heat flow and electric currents in thin ..."

Thorben Casper et al. (2020)

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DOI: 10.1016/J.CAMWA.2019.10.009

access: open

type: Journal Article

metadata version: 2021-05-14

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  - https://dblp.org/rec/journals/cma/CasperRGS20
Thorben Casper, Ulrich Römer, Herbert De Gersem, Sebastian Schöps:
Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging. Comput. Math. Appl. 79(6): 1781-1801 (2020)

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