Fei Chong Ng

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Aizat Abas

> Home > Persons > Fei Chong Ng

Publications

2018
[j3]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/NgAA18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/NgAA18
Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah:
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectron. Reliab. 81: 41-63 (2018)
2017
[j2]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/NgAGAAA17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/NgAGAAA17
Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali:
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. Microelectron. Reliab. 72: 45-64 (2017)
2016
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/NgAIAA16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/NgAIAA16
Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz:
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66: 143-160 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.