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Mike Craven

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2000 – 2009

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2001
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Shatil Haque, Kalyan Siddabattula, Mike Craven, Sihua Wen, Xingsheng Liu, Dushan Boroyevich, Guo-Quan Lu:
Design issues of a three-dimensional packaging scheme for power modules. Microelectron. Reliab. 41(2): 295-305 (2001)

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