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Vinicius C. Do Nascimento

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2025
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Seunghyun Hwang, Michael Joseph Smith, Vinicius C. Do Nascimento, Qiang Qiu, Cheng-Kok Koh, Ganesh Subbarayan, Dan Jiao:
Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 44(7): 2439-2450 (2025)

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