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P. L. Tu

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Journal Articles

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2001
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P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai:
Study of micro-BGA solder joint reliability. Microelectron. Reliab. 41(2): 287-293 (2001)
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Y. C. Chan, P. L. Tu, K. C. Hung:
Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectron. Reliab. 41(11): 1867-1875 (2001)
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P. L. Tu, Y. C. Chan, K. C. Hung:
Reliability of microBGA assembly using no-flow underfill. Microelectron. Reliab. 41(12): 1993-2000 (2001)

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