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Woon-Seong Kwon

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2010 – 2019

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2012
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Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee:
Chip warpage model for reliability prediction of delamination failures. Microelectron. Reliab. 52(4): 718-724 (2012)

2000 – 2009

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2006
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Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik:
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectron. Reliab. 46(2-4): 589-599 (2006)

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