BibTeX record conf/3dic/BeilliardMCCRNA14

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@inproceedings{DBLP:conf/3dic/BeilliardMCCRNA14,
  author       = {Yann Beilliard and
                  St{\'{e}}phane Moreau and
                  L{\'{e}}a Di Cioccio and
                  Perceval Coudrain and
                  G. Romano and
                  A. Nowodzinski and
                  F. Aussenac and
                  P.{-}H. Jouneau and
                  E. Rolland and
                  Thomas Signamarcheix},
  title        = {Advances toward reliable high density Cu-Cu interconnects by Cu-SiO\({}_{\mbox{2}}\)
                  direct hybrid bonding},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7274306},
  doi          = {10.1109/3DIC.2014.7274306},
  timestamp    = {Thu, 21 Jan 2021 17:36:37 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/BeilliardMCCRNA14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}