"Antioxidative Cu Electrodeposition for 3D Interconnects with Hybrid Bonding."

Ryo Aizawa et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830207

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Ryo Aizawa, Masahiro Sawa, Jinta Nampo, Yurina Fukumoto, Murugesan Mariappan, Takafumi Fukushima:
Antioxidative Cu Electrodeposition for 3D Interconnects with Hybrid Bonding. 3DIC 2024: 1-4

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