"3D interconnection using copper direct hybrid bonding for GaN on silicon ..."

Christophe Dubarry et al. (2021)

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DOI: 10.1109/3DIC52383.2021.9687599

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-03

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Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier:
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 3DIC 2021: 1-4

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