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ORCID3DIC 2021: Raleigh, NC, USA
- IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. IEEE 2021, ISBN 978-1-6654-1706-8
- Christophe Dubarry
, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier:
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 1-4 - Patrick Krüger, Thomas Voß, Matthias Wietstruck:
Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling. 1-5 - Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan:
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 1-4 - Qianli Zhao, W. Rhett Davis:
A Virtual Platform for Object Detection Systems. 1-6 - Yuske Ogushi, Satoshi Matsumoto:
Fully integrated transformer less floating gate driver for 3D power supply on chip. 1-6 - Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, Masahiro Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima:
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 1-4 - Shinei Miyasaka, Satoshi Matsumoto:
Numerical predictions of 3D power-supply on chip taking into considerations of proximity effect. 1-4 - Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen:
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via. 1-4 - Koji Kiyoyama, Yoshihiko Horio, Takafumi Fukushima, Hiroyuki Hashimoto, Takemori Orima, Mitsumasa Koyanagi:
Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing. 1-4 - Liangxing Hu, Simon Chun Kiat Goh, Yu Dian Lim, Peng Zhao, Michael Joo Zhong Lim, Chuan Seng Tan:
Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. 1-5 - Ayano Furue, Satoshi Matsumoto:
Numerical investigations for 3D power supply on chip by coupling of thermal-fluid, circuit, and electromagnetic field simulations. 1-5 - Anthony Mastroianni, Benjamin Kerr, Jawad Nasrullah, Kevin Cameron, Hockshan James Wong, David Ratchkov, Joseph A. Reynick:
Proposed Standardization of Heterogenous Integrated Chiplet Models. 1-8 - Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir:
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. 1-5 - Yoshihiko Horio, Takemori Orima, Koji Kiyoyama, Mitsumasa Koyanagi:
Implementation of a Chaotic Neural Network Reservoir on a TSV/μBump Stacked 3D Cyclic Neural Network Integrated Circuit. 1-4 - Prasanth Prabu Ravichandiran, Paul D. Franzon:
A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation. 1-6 - Lee Baker, Robert Patti, Paul D. Franzon:
Multi-ANN embedded system based on a custom 3D-DRAM. 1-7 - Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir:
Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. 1-5
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