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"Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system ..."
Amadine Jouve et al. (2015)
- Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo:
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC 2015: TS1.4.1-TS1.4.8
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