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"Influence of wafer thinning process on backside damage in 3D integration."
Tadao Nakamura et al. (2013)
- Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba:
Influence of wafer thinning process on backside damage in 3D integration. 3DIC 2013: 1-6
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