"Thermal performance of CoolCube™ monolithic and TSV-based 3D ..."

Cristiano Santos et al. (2016)

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DOI: 10.1109/3DIC.2016.7970007

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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Cristiano Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, Lee Wang:
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC 2016: 1-5

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