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Sébastien Thuries
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2020 – today
- 2024
- [c25]Arnaud Verdant, William Guicquero, David Coriat, Guillaume Moritz, Nicolas Royer, Sébastien Thuries, Anais Mollard, Vincent Teil, Yann Desprez, Gilles Monnot, Pierre Malinge, Bruno Paille, Guillaume Caubit, Arnaud Bourge, Laurent Tardif, Stephanie Bigault, Jérôme Chossat:
A 450µW@50fps Wake-Up Module Featuring Auto-Bracketed 3-Scale Log-Corrected Pattern Recognition and Motion Detection in a 1.5Mpix 8T Global Shutter Imager. VLSI Technology and Circuits 2024: 1-2 - 2022
- [j3]Sébastien Thuries, Aida Todri-Sanial
:
Introduction to the Special Issue on Monolithic 3D: Technology, Design and Computing Systems Applications Perspectives. ACM J. Emerg. Technol. Comput. Syst. 18(1): 19:1-19:3 (2022) - 2021
- [j2]Pascal Vivet
, Eric Guthmuller
, Yvain Thonnart
, Gaël Pillonnet
, César Fuguet Tortolero
, Ivan Miro-Panades
, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes
, Sébastien Thuries, David Coriat, Michel Harrand
, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier
, Perceval Coudrain
, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier
, Alexis Farcy, Alexandre Arriordaz
, Séverine Cheramy
, Fabien Clermidy:
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - 2020
- [c24]Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard:
M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE 2020: 1740-1745 - [c23]Pascal Vivet
, Eric Guthmuller
, Yvain Thonnart
, Gaël Pillonnet
, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero
, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain
, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48
2010 – 2019
- 2019
- [c22]Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet
:
Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. 3DIC 2019: 1-5 - [c21]Pascal Vivet
, Gilles Sicard, Laurent Millet, Stéphane Chevobbe
, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier
, Alexandre Valentian, Maria Lepecq
, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy:
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE 2019: 674-679 - [c20]Imed Jani, Didier Lattard, Pascal Vivet
, Jean Durupt, Sébastien Thuries, Edith Beigné:
Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. ETS 2019: 1-2 - 2018
- [c19]Pascal Vivet
, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude:
Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS 2018: 157-160 - [c18]François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, Richard Fournel, Maud Vinet:
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT 2018: 141-144 - [c17]Dusan M. Stipanovic
, Boris Murmann, Matteo Causo, Aleksandra Lekic
, Vicenc Rubies-Royo, Claire J. Tomlin, Edith Beigné, Sébastien Thuries, Mykhailo Zarudniev
, Suzanne Lesecq:
Some Local Stability Properties of an Autonomous Long Short-Term Memory Neural Network Model. ISCAS 2018: 1-5 - 2017
- [j1]Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy:
Cell-on-Buffer: New design approach for high-performance and low-power monolithic 3D integrated circuits. Microelectron. J. 60: 109-118 (2017) - [c16]David Lachartre, Francois Dehmas
, Carolynn Bernier
, Christophe Fourtet, Laurent Ouvry, Florent Lepin, Eric Mercier, Steve Hamard, Lionel Zirphile, Sébastien Thuries, Fabrice Chaix:
7.5 A TCXO-less 100Hz-minimum-bandwidth transceiver for ultra-narrow-band sub-GHz IoT cellular networks. ISSCC 2017: 134-135 - [c15]Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint:
Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI 2017: 539-544 - 2016
- [c14]Guillaume Berhault, Melanie Brocard, Sébastien Thuries, François Galea, Lilia Zaourar:
3DIP: An iterative partitioning tool for monolithic 3D IC. 3DIC 2016: 1-5 - [c13]Gerald Cibrario, Nour Ben Salem, Joris Lacord, Karim Azizi-Mourier, Olivier Rozeau, Etienne Maurin, Olivier Billoint, Sébastien Thuries, Alexandre Valentian:
From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose. 3DIC 2016: 1-5 - [c12]Cristiano Santos, Pascal Vivet
, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain
, Lee Wang:
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC 2016: 1-5 - [c11]Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint:
Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. ESSDERC 2016: 218-221 - [c10]Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot:
Opportunities brought by sequential 3D CoolCube™ integration. ESSDERC 2016: 226-229 - [c9]Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet:
Recent advances in 3D VLSI integration. ICICDT 2016: 1-4 - [c8]Kaya Can Akyel, Henri-Pierre Charles
, Julien Mottin, Bastien Giraud, Gregory Suraci, Sébastien Thuries, Jean-Philippe Noel:
DRC2: Dynamically Reconfigurable Computing Circuit based on memory architecture. ICRC 2016: 1-8 - 2015
- [c7]Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy:
Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC 2015: TS1.3.1-TS1.3.5 - [c6]Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy:
A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. DATE 2015: 1192-1196 - [c5]Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy:
From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. ISPD 2015: 127 - [c4]Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy:
An Unbalanced Area Ratio Study for High Performance Monolithic 3D Integrated Circuits. ISVLSI 2015: 350-355 - [c3]Bartosz Boguslawski, Hossam Sarhan, Frédéric Heitzmann, Fabrice Seguin, Sébastien Thuries, Olivier Billoint, Fabien Clermidy:
Compact interconnect approach for networks of neural cliques using 3D technology. VLSI-SoC 2015: 116-121 - 2014
- [c2]Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy:
3DCoB: A new design approach for Monolithic 3D Integrated circuits. ASP-DAC 2014: 79-84 - 2012
- [c1]Romain Lemaire, Sébastien Thuries, Frédéric Heitzmann:
A flexible modeling environment for a NoC-based multicore architecture. HLDVT 2012: 140-147
Coauthor Index

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