"Addressing thermal and power delivery bottlenecks in 3D circuits."

Sachin S. Sapatnekar (2009)

> Home

Details and statistics

DOI: 10.1109/ASPDAC.2009.4796518

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

- view
  authority control:
- export record
  dblp key:
  - conf/aspdac/Sapatnekar09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/aspdac/Sapatnekar09
Sachin S. Sapatnekar:
Addressing thermal and power delivery bottlenecks in 3D circuits. ASP-DAC 2009: 423-428

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.