"Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault ..."

Kuan-Te Wu et al. (2014)

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DOI: 10.1109/ATS.2014.42

access: closed

type: Conference or Workshop Paper

metadata version: 2023-10-17

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Kuan-Te Wu, Jin-Fu Li, Yun-Chao Yu, Chih-Sheng Hou, Chi-Chun Yang, Ding-Ming Kwai, Yung-Fa Chou, Chih-Yen Lo:
Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs. ATS 2014: 143-148

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