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"Thermal-Safe Test Access Mechanism and Wrapper Co-optimization for ..."

Thomas Edison Yu et al. (2007)

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DOI: 10.1109/ATS.2007.53

access: closed

type: Conference or Workshop Paper

metadata version: 2022-11-09

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Thomas Edison Yu, Tomokazu Yoneda, Krishnendu Chakrabarty, Hideo Fujiwara:
Thermal-Safe Test Access Mechanism and Wrapper Co-optimization for System-on-Chip. ATS 2007: 187-192

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