"General floorplanning methodology for 3D ICs with an arbitrary bonding style."

Jai-Ming Lin, Chien-Yu Huang (2018)

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DOI: 10.23919/DATE.2018.8342197

access: closed

type: Conference or Workshop Paper

metadata version: 2018-04-24

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Jai-Ming Lin, Chien-Yu Huang:
General floorplanning methodology for 3D ICs with an arbitrary bonding style. DATE 2018: 1199-1202

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