"Shielding structures for through silicon via (TSV) to active circuit noise ..."

Jaemin Lim et al. (2015)

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DOI: 10.1109/EMCCOMPO.2015.7358366

access: closed

type: Conference or Workshop Paper

metadata version: 2019-09-16

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Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim:
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo 2015: 248-251

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