"200 mm Wafer level graphene transfer by wafer bonding technique."

Mesut Inac et al. (2017)

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DOI: 10.1109/ESSDERC.2017.8066630

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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  - conf/essderc/InacLWLFMCK17
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  - https://dblp.org/rec/conf/essderc/InacLWLFMCK17
Mesut Inac, Grzegorz Lupina, Matthias Wietstruck, Marco Lisker, Mirko Fraschke, Andreas Mai, Fabio Coccetti, Mehmet Kaynak:
200 mm Wafer level graphene transfer by wafer bonding technique. ESSDERC 2017: 216-219

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