"On composition of mechatronic components enabled by interoperability and ..."

Sandeep Patil et al. (2013)

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DOI: 10.1109/ETFA.2013.6648136

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

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Sandeep Patil, Jeffrey Yan, Valeriy Vyatkin, Cheng Pang:
On composition of mechatronic components enabled by interoperability and portability provisions of IEC 61499: A case study. ETFA 2013: 1-4

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