"3D module placement for congestion and power noise reduction."

Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh (2005)

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DOI: 10.1145/1057661.1057770

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh:
3D module placement for congestion and power noise reduction. ACM Great Lakes Symposium on VLSI 2005: 458-461

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