"Redistribution layer routing for integrated fan-out wafer-level chip-scale ..."

Bo-Qiao Lin, Ting-Chou Lin, Yao-Wen Chang (2016)

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DOI: 10.1145/2966986.2967070

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Bo-Qiao Lin, Ting-Chou Lin, Yao-Wen Chang:
Redistribution layer routing for integrated fan-out wafer-level chip-scale packages. ICCAD 2016: 23

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