"Chip Scale Packaging and Its Failure Analysis Challenges (invited)."

Susan Li (2025)

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DOI: 10.1109/IRPS48204.2025.10983086

access: closed

type: Conference or Workshop Paper

metadata version: 2025-06-04

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Susan Li:
Chip Scale Packaging and Its Failure Analysis Challenges (invited). IRPS 2025: 1-9

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