"Chip Board Package Interaction Reliability for Large Size FCBGA Package."

Richard Rao et al. (2025)

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DOI: 10.1109/IRPS48204.2025.10982991

access: closed

type: Conference or Workshop Paper

metadata version: 2025-10-13

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Richard Rao, Sean Hsu, Ivan Tan, Steve Yang, Shrinath Ramdas, Dwayne R. Shirley, Kevin Caffey:
Chip Board Package Interaction Reliability for Large Size FCBGA Package. IRPS 2025: 1-6

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