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"A multi-story power delivery technique for 3D integrated circuits."

Pulkit Jain et al. (2008)

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DOI: 10.1145/1393921.1393940

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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  dblp key:
  - conf/islped/JainKKK08
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  - https://dblp.org/rec/conf/islped/JainKKK08
Pulkit Jain, Tony Tae-Hyoung Kim, John Keane, Chris H. Kim:
A multi-story power delivery technique for 3D integrated circuits. ISLPED 2008: 57-62

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