"On Legalization of Die Bonding Bumps and Pads for 3D ICs."

Sai Pentapati et al. (2023)

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DOI: 10.1145/3569052.3578925

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-28

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Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim:
On Legalization of Die Bonding Bumps and Pads for 3D ICs. ISPD 2023: 62-70

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