"Active Device under Bond Pad to Save I/O Layout for High-pin-count SOC."

Ming-Dou Ker, Jeng-Jie Peng, Hsin-Chin Jiang (2003)

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DOI: 10.1109/ISQED.2003.1194738

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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