"6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 ..."

Christophe Erdmann et al. (2014)

> Home

Details and statistics

DOI: 10.1109/ISSCC.2014.6757364

access: closed

type: Conference or Workshop Paper

metadata version: 2020-08-10

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/isscc/ErdmannLLKMCBKL14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/isscc/ErdmannLLKMCBKL14
Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden:
6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters. ISSCC 2014: 120-121

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.