"37.4 SHINSAI: A 586mm2 Reusable Active TSV Interposer with ..."

Bo Jiao et al. (2025)

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DOI: 10.1109/ISSCC49661.2025.10904819

access: closed

type: Conference or Workshop Paper

metadata version: 2025-04-27

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Bo Jiao, Haozhe Zhu, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Mochen Tian, Zexing Chen, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu:
37.4 SHINSAI: A 586mm² Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory. ISSCC 2025: 1-3

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