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"Low-cost testing of TSVs in 3D stacks with pre-bond testable dies."
Sying-Jyan Wang, Yu-Siao Chen, Katherine Shu-Min Li (2013)
- Sying-Jyan Wang, Yu-Siao Chen, Katherine Shu-Min Li:
Low-cost testing of TSVs in 3D stacks with pre-bond testable dies. VLSI-DAT 2013: 1-4
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