"Low-cost testing of TSVs in 3D stacks with pre-bond testable dies."

Sying-Jyan Wang, Yu-Siao Chen, Katherine Shu-Min Li (2013)

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DOI: 10.1109/VLDI-DAT.2013.6533888

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Sying-Jyan Wang, Yu-Siao Chen, Katherine Shu-Min Li:
Low-cost testing of TSVs in 3D stacks with pre-bond testable dies. VLSI-DAT 2013: 1-4

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