"Low-cost testing of TSVs in 3D stacks with pre-bond testable dies."

Sying-Jyan Wang, Yu-Siao Chen, Katherine Shu-Min Li (2013)

Details and statistics

DOI: 10.1109/VLDI-DAT.2013.6533888

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

a service of  Schloss Dagstuhl - Leibniz Center for Informatics