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"Warpage analysis of organic substrates for 2.1D packaging."
Sayuri Kohara et al. (2015)
- Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama, Hiroyuki Mori:
Warpage analysis of organic substrates for 2.1D packaging. 3DIC 2015: TS8.17.1-TS8.17.5
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